什么是X射線熒光鍍層涂層測(cè)厚法？

材料的涂層厚度是一個(gè)重要的工藝參數(shù)。它直接影響零件或產(chǎn)品的耐腐蝕性、裝飾效果、導(dǎo)電性、產(chǎn)品可靠性和使用壽命。因此，涂層的厚度在產(chǎn)品質(zhì)量、工藝控制和成本控制中起著重要作用。

什么是電鍍/涂層？

電鍍是指在一些物品的金屬表面涂上一層有機(jī)物，或薄薄的一層金屬或仿制某種貴金屬，為了美觀或存放，在普通金屬表面鍍上這種貴金屬。 .復(fù)合鍍層的制備是在鍍液中加入一種或幾種不溶性固體顆粒，使固體顆粒與金屬離子共沉積的過(guò)程。它實(shí)際上是一種金屬基復(fù)合材料。

什么是涂層厚度測(cè)試？有哪些方法？

涂層厚度測(cè)試檢測(cè)材料表面金屬和氧化物涂層的厚度。鍍層厚度的測(cè)量方法主要有金相法、X射線熒光法和掃描電子顯微鏡測(cè)量法等。

XRF鍍層測(cè)厚儀俗稱(chēng)X射線熒光測(cè)厚儀、鍍層測(cè)厚儀、薄膜測(cè)厚儀、薄膜測(cè)厚儀、金鎳測(cè)厚儀、電鍍薄膜測(cè)厚儀等，主要用于精確測(cè)量涂層的厚度。金屬電鍍層。

XRF涂層測(cè)厚儀：

俗稱(chēng)X射線熒光測(cè)厚儀、鍍層測(cè)厚儀、薄膜測(cè)厚儀、薄膜測(cè)厚儀、金鎳測(cè)厚儀、電鍍薄膜測(cè)厚儀等；

功能：精密測(cè)量金屬鍍層厚度；

應(yīng)用范圍：測(cè)量涂層、涂層、薄膜、液體的厚度或成分，測(cè)量范圍從12（Mg）到92（U）

使用X射線的非接觸式厚度測(cè)量裝置可以讓探測(cè)器檢測(cè)穿透目標(biāo)物體的量子X(jué)射線量，或穿透目標(biāo)物體的熒光X射線量來(lái)測(cè)量厚度的目標(biāo)對(duì)象。探測(cè)器探測(cè)到的量子X(jué)射線或熒光X射線的數(shù)量因目標(biāo)物體的材料而異，其吸收系數(shù)、密度和厚度各不相同。無(wú)需比較目標(biāo)物體的量子 X 射線量和穿過(guò)目標(biāo)物體并從 X 射線目標(biāo)發(fā)射的 X 射線量。厚度。

校準(zhǔn)曲線是通過(guò)比較具有基層的參考樣品的基層和由其上形成的薄膜層形成的基層中特定元素散射的信號(hào)強(qiáng)度與薄層厚度之間的差異來(lái)確定的。通過(guò)將具有基層的參考樣品的基層和其上形成有基層的目標(biāo)樣品的基層中的特定元素散射的信號(hào)與校準(zhǔn)進(jìn)行比較來(lái)確定目標(biāo)樣品膜層厚度。

典型的鍍層厚度光譜圖（鐵鍍鎳鍍金）

The coating thickness of the material is an important process parameter. It directly affects the corrosion resistance, decorative effect, electrical conductivity, product reliability and service life of parts or products. Therefore, the thickness of the coating plays an important role in product quality, process control, and cost control.

What is plating/coating?

Plating refers to coating a layer of organic matter, or a thin layer of metal or imitating some kind of precious metal, on the metal surface of some items for good-looking or storage, and plating this precious metal on the surface of ordinary metal. . The preparation of composite coating is a process of adding one or several insoluble solid particles to the plating solution to co-deposit the solid particles and metal ions. It is actually a metal-based composite material.

What is the coating thickness test? What are the methods?

Coating thickness test detects the thickness of metal and oxide coatings on the surface of the material. The measurement methods of coating thickness mainly include metallographic method, X-ray fluorescence method and scanning electron microscope measurement method and so on.

XRF coating thickness gauges are commonly known as X-ray fluorescence thickness gauges, coating thickness gauges, film thickness gauges, film thickness testers, gold-nickel thickness testers, electroplating film thickness gauges, etc. They are mainly used to accurately measure the thickness of metal electroplating layers.

XRF coating thickness gauge:

Commonly known as X-ray fluorescence thickness gauge, coating thickness gauge, film thickness gauge, film thickness tester, gold nickel thickness tester, electroplating film thickness gauge, etc.;

Function: precise measurement of the thickness of the metal plating layer;

Application range: measuring the thickness or composition of coatings, coatings, films, liquids, measuring range from 12 (Mg) to 92 (U)

The non-contact thickness measuring device using X-rays can allow the amount of quantum X-rays penetrating the target object to be detected by the detector, or the amount of fluorescent X-rays penetrating the target object to be detected to measure the thickness of the target object. The amount of quantum X-rays or fluorescent X-rays detected by the detector in response to the material of the target object varies in absorption coefficient, density, and thickness. It is not necessary to compare the amount of quantum X-rays of the target object and the amount of X-rays irradiated to pass through the target object and emitted from the X-ray target. thickness.

The calibration curve is determined by comparing the difference between the intensity of the signal scattered by the specific element in the base layer of the reference sample having the base layer and the base layer formed by the thin film layer formed thereon with the thickness of the thin film layer, and The target is determined by comparing the intensity difference between the signal scattered by a specific element in the base layer of the reference sample having the base layer and the base layer of the target sample having the base layer formed thereon with the calibration curve. The thickness of the film layer of the sample